In electronics packaging glass becomes more and more important. Properties like flatness, thermal stability, and even high optical transmission bring glass as a material to a leading role within electronics components. Glass is used for packaging applications for instance as a capping wafer, spacer, interposer, or glass embedded fan-out package. The packages are typically manufactured on wafers with a diameter of up to 300 mm. As glass is also available in large panels, it simplifies scale-up and cost reduction when going towards panel processing.
Within several production chains of the electronics industry, there is a need to process features like cavities and through glass vias (TGV, holes). Often glass wafers need to be cut into dice at the end of the production process. Classical techniques are reaching their limits triggered by miniaturization and higher quality requirements. Within all those applications the selectivity and flexibility of laser processing can help to improve quality and performance.